Doosan to Supply Copper-Clad Laminates to Amazon for AI Accelerator Chips

Reporter Kim Jisun / approved : 2025-08-05 03:43:00
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Photo courtesy of Yonhap News

 

 

[Alpha Biz= Kim Jisun] SEOUL, July 4 — South Korea’s Doosan Group has secured a deal to supply copper-clad laminates (CCLs) to Amazon, which is developing custom application-specific integrated circuits (ASICs) optimized for AI inference services.



According to industry sources, Doosan Corporation’s Electronics Business Group (Electronics BG) recently passed Amazon’s rigorous quality certification process for CCLs and is expected to begin shipments as early as Q3 2024.



CCLs are composite sheets consisting of a thin copper foil laminated onto an insulating layer made of glass fiber and resin. They are a core material in semiconductor package substrates, with growing importance in advanced electronics and high-performance computing.



Doosan Electronics BG manufactures its CCLs at its Jeungpyeong plant in North Chungcheong Province using copper foil supplied by Lotte Energy Materials and Solus Advanced Materials. The CCLs are then delivered to Taiwanese printed circuit board (PCB) makers, which supply finished components to Amazon. Order quantities and pricing are determined monthly, and demand is expected to rise alongside Amazon’s expanding deployment of AI ASICs.



If Amazon's orders scale as projected, Doosan's Electronics BG could see an annual revenue boost of up to KRW 150 billion (approx. USD 110 million).



In parallel, Doosan Electronics BG is also undergoing quality certification with Google for its CCLs used in Tensor Processing Units (TPUs)—Google's proprietary AI accelerator chips. Currently, Panasonic supplies these CCLs, but sources indicate it may be phased out due to quality concerns. If Doosan receives approval, it is expected to begin mass production for Google in the first half of 2025.

 

 

 

Alphabiz Reporter Kim Jisun(stockmk2020@alphabiz.co.kr)

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