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[Alpha Biz=(Chicago) Reporter Kim Jisun] Samsung Electronics is taking the lead in the next-generation high-bandwidth memory market with products that meet the demands of the artificial intelligence (AI) market and technology trends.
According to the industry on the 22nd, Samsung Electronics has completed the final quality approval of HBM3 and packaging from AMD. As a result, it is expected that AI semiconductor shipments will increase and new customers will expand in the future.
KB Securities expects Samsung Electronics' new HBM3 customers to increase from 4∼5 this year to 8∼10 next year and expand its market share in the HBM market, which is expected to be in short supply over the next two years.
Recently, Taiwanese market research firm TrendForce predicted that Samsung Electronics' HBM market share will increase to 46∼49% this year and 47∼49% next year thanks to increased orders from cloud service providers (CSP).
Samsung Electronics is planning to release the 5th generation HBM HBM3P based on 24 gigabytes (GB) in the second half of this year.
According to KB Securities, Samsung Electronics is the only company that has established a turnkey (batch production) production system for HBM products and plans to start supplying turnkeys for all HBM processes from 2024.
Alphabiz Reporter Kim Jisun(stockmk2020@alphabiz.co.kr)
