SK Hynix is ​​expanding its back-end process manpower due to soaring demand for HBM.

Reporter Paul Lee / approved : 2023-08-25 00:30:24
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[Apha Biz=(Chicago) Reporter Paul Lee] According to the semiconductor industry on the 24th, the wafer-level package (WLP) division under SK Hynix's P&T (PKG&Test) organization has recently decided to redeploy and recruit post-process technology personnel as part of its in-house career growth program (CGP).

The organization is responsible for both the development and mass production of next-generation post-process technologies. SK Hynix is collecting individual technical personnel on whether to transfer to the WLP division. The exact size of the relocation has not been set, but it is expected to reach at least a few dozen.

The recruitment of manpower is due to the recent surge in HBM demand on the basis of AI investment expansion. As demand for HBM increases, the volume of post-process business units will increase in proportion to this. "We announced in a conference call that we will reduce overall investment but put priority on expanding mass production of HBM products," a company official said. "It is a business adjustment to relocate personnel in related fields in the company in line with the investment stance."

Due to the nature of the HBM product that connects multiple DRAM chips vertically, advanced post-process technology that connects different chips and makes them move like a single semiconductor is an important factor in determining performance and production. As chips are stacked, it is also important to efficiently release the collected heat, which is also an area of post-process technology.

SK Hynix is expected to increase the size of its post-process workforce. According to market research firm TrendForce, SK Hynix's market share in the global DRAM market rose from 24.4% in the first quarter to 30% in the second quarter due to a surge in HBM shipments. Sales of HBM and graphics DRAMs are also growing rapidly, surpassing 20% in the second quarter after surpassing double digits last year. Recently, customer performance verification for next-generation HBM3E has also begun.

 

Alphabiz Reporter Paul Lee(hoondork1977@alphabiz.co.kr)

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