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Hanmi semiconductor. (photo = Hanmi semiconductor) |
[Alpha Biz= Kim Jisun] Hanwha Semitec has issued a formal legal notice to Hanmi Semiconductor, demanding the immediate cessation of what it claims to be the dissemination of false information concerning its semiconductor equipment business.
According to industry sources on April 24, Hanwha Semitec, through its legal representative Law Firm Bae, Kim & Lee LLC (Taepyungyang), sent a certified document on April 23 to a senior executive at Hanmi Semiconductor. The notice calls for a halt to the spread of misinformation and demands corrective action. It also warns of potential civil and criminal legal action should the issue not be resolved.
The dispute centers around remarks made by the Hanmi executive during a broadcast appearance in March, in which he reportedly claimed that an image publicly released by Hanwha Semitec of its thermal compression bonding (TC bonder) equipment was actually of a flip chip bonder. Hanwha Semitec contends that these statements are factually incorrect and that additional false claims were made about the company’s R&D capabilities and corporate history.
This incident comes in the wake of a patent infringement lawsuit filed by Hanmi Semiconductor against Hanwha Semitec in December 2024. The suit alleges that Hanwha’s TC bonder equipment infringes on Hanmi’s patents. Hanwha Semitec has since submitted a response to the court, setting the stage for a legal showdown between the two semiconductor equipment firms.
Hanwha Semitec has expressed its intent to defend its technological integrity and corporate reputation through all available legal avenues.
Alphabiz Reporter Kim Jisun(stockmk2020@alphabiz.co.kr)
