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(Photo= Solus advanced material) |
[Alpha Biz= Reporter Kim Jisun] Solus Advanced Materials announced on July 1st that they have received final production approval from NVIDIA to supply their high-end copper foil, known as High-VLP (Very Low Profile) copper foil, to Doosan Electronics BG (Business Group), a manufacturer of Copper-Clad Laminates (CCL).
Solus Advanced Materials' HVLP copper foil is set to be integrated into NVIDIA's next-generation artificial intelligence (AI) accelerators scheduled for release this year. HVLP copper foil is designed to minimize surface roughness (roughness below 0.6 micrometers) to reduce signal loss in electronic products. It finds applications in AI accelerators, 5G communication equipment, and high-efficiency signal transmission network substrate materials.
Solus Advanced Materials is reportedly the first Korean company to supply copper foil for AI accelerators to NVIDIA.
Alphabiz Reporter Kim Jisun(stockmk2020@alphabiz.co.kr)
