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Hanmi Semiconductor. (Photo = Hanmi Semiconductor) |
[Alpha Biz= Kim Jisun] A rift is widening between SK Hynix and its key equipment partner Hanmi Semiconductor, triggered by the chipmaker’s move to diversify its supply chain for TC bonders, a crucial component in advanced memory manufacturing.
According to the semiconductor industry on Wednesday, Hanmi Semiconductor has withdrawn all customer service engineers stationed at SK Hynix. Prior to this, Hanmi also notified SK Hynix of a 25% price hike on its TC bonder equipment.
TC bonders use heat and pressure to stack DRAM layers and are essential in manufacturing high-performance memory like HBM (High Bandwidth Memory). For SK Hynix’s latest HBM3E 12-layer product, more than 90% of production reportedly relies on Hanmi's TC bonders.
The two companies have maintained a close partnership since 2017, co-developing HBM technology. SK Hynix leveraged Hanmi’s tools to accelerate HBM development, while Hanmi enjoyed stable profits—recording its highest-ever revenue of ₩558.9 billion and an operating margin of 45.6% in 2023. Meanwhile, SK Hynix has cemented its position as the global market leader in HBM.
However, the relationship soured earlier this year when SK Hynix placed a ₩42 billion order for 14 TC bonders from Hanwha Semitek, a rival firm. At the time, Hanmi was already pursuing patent infringement litigation against Hanwha Semitek and expressed strong objections to SK Hynix adopting what it claimed were infringing products.
Both companies have refrained from making public comments on the dispute. SK Hynix stated, “We are unable to comment on matters related to partners,” while Hanmi Semiconductor said, “We have nothing to share.”
The standoff underscores rising supply chain tensions in the semiconductor sector, especially as HBM emerges as a key battleground in the AI era.
Alphabiz Reporter Kim Jisun(stockmk2020@alphabiz.co.kr)
